Technical-V meeting (IAI – Tel Aviv)
IAI invited the AMISA consortium for the Technical Meeting-V from the 28th February to the 1st March 2012. Before this meeting, the DFA-tool (RLS-00) was sent to the consortium members in order to enable the partners to install the tool on their machines and implement part of their pilot projects within this tool.
Technical-IV meeting (TTI - Santander)
From the 13th until 15th December 2011, the Technical Meeting IV of the AMISA consortium took place in Santander (Spain) hosted by TTI. Beside the universities TAU and TUM, further industrial partners who attended the meeting were MAG switzerland, Tetra Pak, IAI and Optoelectronica. Every member introduced an example to the entire consortium in terms of the evolutionary forecast and the interface cost calculation. Tetra Pak presented “Cap applicators for Tetra Pak packages”, MAG switzerland “Production line for crystalline silicon modules “, IAI “Vehicle Localization System”, TTI “Solid State Power Amplifier” and Optoelectronica “Hologram Production Line”.
Academic forum (TAU Tel-Aviv)
From the 27th until the 30th of October 2011, TAU, TUM and IAI met to discuss several technical issues. First, the team discussed some important subjects of the methodology. Several of these were the Black-Scholes equation and its variables, the adaptability factor and its further use, the architecture options and the AMISA Primary Equation.